Standard

IEC 61188-6-1:2021 ED1

Feb 2021 Current

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Language English/French

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Abstract

IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.

Products specifications

Standard from IEC
Published: February 23 2021
Edition: 1
Document type: IS
Pages
ISBN: 9782832294437

Publisher: IEC
Distributor: IEC
ICS: 31.180
ICS: 31.190
International TC: TC 91

Product Relations

Replaces: IEC 61188-5-1:2002 ED1

IEC 61188-6-1:2021 ED1

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