Standard

IEC 61188-5-3:2007 ED1

Oct 2007 Current

Existing or new amendments and versions must be purchased separately.

Language English English/French

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Abstract

IEC 61188-5-3:2007 provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on two sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints. Each clause contains a specific set of criteria such that the information presented is consistent, providing information on the component, the component dimensions, the solder joint design, and the land pattern dimensions. This publication is to be read in conjunction with IEC 61188-5-1 :2002.

Products specifications

Standard from IEC
Published: October 30 2007
Edition: 1
Document type: IS
Pages
ISBN: 2831893402

Publisher: IEC
Distributor: IEC
ICS: 31.180
International TC: TC 91

Product Relations

Partially replaced by: IEC 61188-6-2:2021 ED1

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Abstract

Products specifications

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