Standard

IEC 61188-5-2:2003 ED1

Current

Existing or new amendments and versions must be purchased separately.

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Abstract

Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.

Products specifications

  • Standard from IEC
  • Published:
  • Edition: 1
  • Document type: IS
  • Pages
  • Publisher: IEC
  • Distributor: IEC
  • ICS: 31.180
  • ICS: 31.190
  • International TC: TC 91

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