Standard

IEC 61188-5-1:2002 ED1

Replaced

Existing or new amendments and versions must be purchased separately.

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Abstract

Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.

Products specifications

  • Standard from IEC
  • Published:
  • Withdrawn:
  • Edition: 1
  • Document type: IS
  • Pages
  • Publisher: IEC
  • Distributor: IEC
  • ICS: 31.180
  • ICS: 31.190
  • International TC: TC 91

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