Standard

IEC 61188-5-1:2002 ED1

Jul 2002 Replaced

Existing or new amendments and versions must be purchased separately.

Language English/French

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Abstract

Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.

Products specifications

Standard from IEC
Published: July 12 2002
Withdrawn: February 24 2021
Edition: 1
Document type: IS
Pages
ISBN: 2831864496

Publisher: IEC
Distributor: IEC
ICS: 31.180
ICS: 31.190
International TC: TC 91

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Replaced by: IEC 61188-6-1:2021 ED1

IEC 61188-5-1:2002 ED1

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Abstract

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Abstract

Products specifications

Product Relations

Product life cycle