IEC 61188-1-2:1998 ED1


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The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.

Products specifications

  • Standard from IEC
  • Published:
  • Withdrawn:
  • Edition: 1
  • Document type: IS
  • Pages
  • ISBN: 2831843677
  • Publisher: IEC
  • Distributor: IEC
  • ICS: 31.180
  • International TC: TC 91