Standard

IEC 60749-5:2023 ED3

Dec 2023 Current

Existing or new amendments and versions must be purchased separately.

Language English/French

Services Online + Pdf CHF 42.00 Online CHF 36.00

Open
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test Current IEC 60749-5:2023 RLV Redline Publication date: Dec 2023 Language: English Services: Online, Online + Pdf

There are no available corrigendum or amendments for this standard. Any future corrigendum and amendments will be added automatically for subscribers.

Abstract

IEC 60749-5:2023 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. This test method is considered destructive. This edition includes the following significant technical changes with respect to the previous edition: a) The specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test; b) The specification of the test equipment fixtures is changed to require the avoidance of condensation on devices under test and on electrical fixtures connecting the devices to the test equipment; c) replacement of references to “virtual junction” with “die”.

Products specifications

Standard from IEC
Published: December 19 2023
Edition: 3
Document type: IS
Pages
ISBN: 9782832280331

Publisher: IEC
Distributor: IEC
ICS: 31.080.01
International TC: TC 47

Product Relations

Adopted by: NF EN IEC 60749-5:2024
Adopted by: SN EN IEC 60749-5:2024
Revises: IEC 60749-5:2017 ED2
FRANKFURT AGREEMENT: FprEN IEC 60749-5:2023

IEC 60749-5:2023 ED3

Create subscription