Standard

IEC 60749-30:2005 ED1

Revised

Note: Latest version: IEC 60749-30:2020 ED2

Existing or new amendments and versions must be purchased separately.

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Abstract

Establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing in order to evaluate long term reliability.

Products specifications

  • Standard from IEC
  • Published:
  • Withdrawn:
  • Edition: 1
  • Document type: IS
  • Pages
  • Publisher: IEC
  • Distributor: IEC
  • ICS: 31.080.01
  • International TC: TC 47

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