Consolidated

IEC 60749-30:2005+AMD1:2011 CSV ED1.1

Aug 2011 Revised

Note: Latest version: IEC 60749-30:2020 ED2

Existing or new amendments and versions must be purchased separately.

Language English/French

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Abstract

IEC 60749-30:2005+A1:2011 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). This consolidated version consists of the first edition (2005) and its amendment 1 (2011). Therefore, no need to order amendment in addition to this publication.

Products specifications

Consolidated from IEC
Published: August 10 2011
Withdrawn: August 17 2020
Edition: 1.1
Document type: IS
Pages
ISBN:

Publisher: IEC
Distributor: IEC
ICS: 31.080.01
International TC: TC 47

Product Relations

Revised by: IEC 60749-30:2020 ED2
Revised by: IEC 60749-30:2020 RLV
Replaces: IEC PAS 62182:2000 ED1

IEC 60749-30:2005+AMD1:2011 CSV ED1.1

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IEC 60749-30:2020 ED2