Standard

IEC 60749-19:2003 ED1

Current

Note: Latest version: IEC 60749-19:2003+AMD1:2010 CSV

Existing or new amendments and versions must be purchased separately.

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Abstract

Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. Generally only applicable to cavity packages or as a process monitor.

Products specifications

  • Standard from IEC
  • Published:
  • Edition: 1
  • Document type: IS
  • Pages
  • Publisher: IEC
  • Distributor: IEC
  • ICS: 31.080.01
  • International TC: TC 47

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