Standard

IEC 60749-19:2003+AMD1:2010 CSV ED1.1

Nov 2010 Current

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Abstract

IEC 60749-19:2003+A1:2010 determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. This test method is generally only applicable to cavity packages or as a process monitor. It is not applicable for die areas greater than 10 mm2. It is also not applicable to flip chip technology or to flexible substrates. This consolidated version consists of the first edition (2003) and its amendment 1 (2010). Therefore, no need to order amendment in addition to this publication.

Products specifications

Standard from IEC
Published: November 29 2010
Edition: 1.1
Document type: IS
Pages
ISBN:

Publisher: IEC
Distributor: IEC
ICS: 31.080.01
International TC: TC 47

IEC 60749-19:2003+AMD1:2010 CSV ED1.1

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