Standard

IEC 60352-5:2008 ED3

Jan 2008 Revised

Note: Latest version: IEC 60352-5:2020 ED5

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Abstract

Determines the suitability of press-in connections under specified mechanical, electrical and atmospheric conditions. Is applicable to solderless press-in connections for use in telecommunication equipment and in electronic devices employing similar techniques. Changes with respect to the previous edition deal with: use of four layer test boards; sample tolerance range requirements; use of platings other than tin or tin/lead.

Products specifications

Standard from IEC
Published: January 10 2008
Withdrawn: February 22 2012
Edition: 3
Document type: IS
Pages
ISBN: 2831895227

Publisher: IEC
Distributor: IEC
ICS: 31.220.10
International TC: TC 48/SC 48B

Product Relations

Revised by: IEC 60352-5:2012 ED4
Revises: IEC 60352-5:2001+AMD1:2003 CSV
Revises: IEC 60352-5:2001 ED2

IEC 60352-5:2008 ED3

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IEC 60352-5:2020 ED5

IEC 60352-5:2012 ED4