Standard

IEC 60317-0-1:1997+AMD1:1999+AMD2:2005 CSV ED2.2

Nov 2005 Revised

Note: Latest version: IEC 60317-0-1:2013+AMD1:2019 CSV

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Abstract

Specifies the general requirements of enamelled round copper winding wires with or without bonding layer. This publication supersedes IEC 60182-1 (1984) and IEC 60182-2 (1987). This consolidated version consists of the second edition (1997), its amendment 1 (1999) and its amendment 2 (2005). Therefore, no need to order amendments in addition to this publication.

Products specifications

Standard from IEC
Published: November 21 2005
Withdrawn: March 11 2008
Edition: 2.2
Document type: IS
Pages
ISBN:

Publisher: IEC
Distributor: IEC
ICS: 29.060.10
International TC: TC 55

Product Relations

Revised by: IEC 60317-0-1:2008 ED3
Revises: IEC 60317-0-1:1990 ED1

IEC 60317-0-1:1997+AMD1:1999+AMD2:2005 CSV ED2.2

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IEC 60317-0-1:2013+AMD1:2019 CSV

IEC 60317-0-1:2013 ED4

IEC 60317-0-1:2008 ED3