Standard

IEC 60300-3-7:1999 ED1

May 1999 Replaced

Existing or new amendments and versions must be purchased separately.

Language English/French

Services Online + Pdf CHF 263.00 Online CHF 225.00

There are no extended editions available for this standard

There are no available corrigendum or amendments for this standard. Any future corrigendum and amendments will be added automatically for subscribers.

Abstract

Serves as an application guide to a reliability stress screening process for electronic hardware. The concept, purpose and justification of the screening process are explained. The standard is intended as a guide to be used with one of the IEC reliability stress screening standards. It gives guidance in cases where it is essential that early failures be removed from the items manufactured in order to deliver them to the customer when the problems causing the early failures are solved. It gives guidance on where the reliability stress screening should be carried out, i.e. component, subsystem or system level.

Products specifications

Standard from IEC
Published: May 31 1999
Withdrawn: May 11 2007
Edition: 1
Document type: IS
Pages
ISBN: 2831847974

Publisher: IEC
Distributor: IEC
ICS: 03.120.01
ICS: 31.020
International TC: TC 56

Product Relations

Partially replaced by: IEC 61163-1:2006 ED2
Partially replaced by: IEC 61163-2:1998 ED1

Create subscription

Extended editions Extended editions (0)

Version history Related Corrigenda and Amendments (0)

Abstract

Products specifications

Product Relations