Standard

IEC 60191-6-2:2001 ED1

Dec 2001 Current

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Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages Current IEC 60191-6-2:2001/COR1:2002 ED1 Corrigendum from Publication date: Oct 2002 Language: English Services: Online, Online + Pdf

Abstract

IEC 60191-6-2:2001 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).

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Standard from IEC
Published: December 11 2001
Edition: 1
Document type: IS
Pages
ISBN: 2831860873

Publisher: IEC
Distributor: IEC
ICS: 31.080.01
International TC: TC 47/SC 47D

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Version history Related Corrigenda and Amendments (1)

IEC 60191-6-2:2001/COR1:2002 ED1

Abstract

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