Standard

IEC 60191-6-2:2001 ED1

Current

Existing or new amendments and versions must be purchased separately.

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Abstract

IEC 60191-6-2:2001 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).

Products specifications

  • Standard from IEC
  • Published:
  • Edition: 1
  • Document type: IS
  • Pages
  • Publisher: IEC
  • Distributor: IEC
  • ICS: 31.080.01
  • International TC: TC 47/SC 47D