Standard

IEC 60068-2-69:1995 ED1

Dec 1995 Revised

Note: Latest version: IEC 60068-2-69:2017+AMD1:2019 CSV

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Abstract

Describes two wetting balance methods. These methods determine quantitatively the solderability of terminations on surface mounted devices. The procedures describe the solder bath wetting balance method and the solder globuwetting balance method and are both applicable to components with metallic termination and metallized solder pads.

Products specifications

Standard from IEC
Published: December 8 1995
Withdrawn: May 9 2007
Edition: 1
Document type: IS
Pages
ISBN: 283183628X

Publisher: IEC
Distributor: IEC
ICS: 19.040
International TC: TC 91

Product Relations

Revised by: IEC 60068-2-69:2007 ED2

IEC 60068-2-69:1995 ED1

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IEC 60068-2-69:2017+AMD1:2019 CSV

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