Standard

IEC 60068-2-69:1995 ED1

Revised

Note: Latest version: IEC 60068-2-69:2017+AMD1:2019 CSV

Existing or new amendments and versions must be purchased separately.

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Abstract

Describes two wetting balance methods. These methods determine quantitatively the solderability of terminations on surface mounted devices. The procedures describe the solder bath wetting balance method and the solder globuwetting balance method and are both applicable to components with metallic termination and metallized solder pads.

Products specifications

  • Standard from IEC
  • Published:
  • Withdrawn:
  • Edition: 1
  • Document type: IS
  • Pages
  • Publisher: IEC
  • Distributor: IEC
  • ICS: 19.040
  • International TC: TC 91

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