Standard

IEC 60068-2-20:2008 ED5

Jul 2008 Revised

Note: Latest version: IEC 60068-2-20:2021 ED6

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Abstract

IEC 60068-2-20:2008 outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this standard include the solder bath method and soldering iron method. The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering. The major technical changes with regard to the fourth edition are the following: - the solder globule test is deleted; - test conditions and requirements for lead-free solders are added.

Products specifications

Standard from IEC
Published: July 21 2008
Withdrawn: March 30 2021
Edition: 5
Document type: IS
Pages
ISBN: 2831899192

Publisher: IEC
Distributor: IEC
ICS: 19.040
International TC: TC 91

Product Relations

Revised by: IEC 60068-2-20:2021 ED6
Revised by: IEC 60068-2-20:2021 RLV
Adopted by: NF EN 60068-2-20:2013
Revises: IEC 60068-2-20:1979 ED4

IEC 60068-2-20:2008 ED5

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IEC 60068-2-20:2021 ED6