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Standard

IEC 61760-4:2015 ED1

Aktuell

Hinweis: Neuste Ausgabe: IEC 61760-4:2015+AMD1:2018 CSV

Vorschau

Bestehende oder zukünftige Amendments und Versionen müssen separat erworben werden.

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Zusammenfassung

IEC 61760-4:2015 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling. It also extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging. This standard applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to semiconductor devices and devices for flow (wave) soldering.

Produktspezifikationen

  • Standard von IEC
  • Ausgabedatum:
  • Edition: 1
  • Dokumenttyp: IS
  • Seiten
  • Herausgeber: IEC
  • Lieferant: IEC
  • ICS: 31.190
  • Internationales Komitee: TC 91