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IEC 60749-5:2023 RLV

Aktuell

Hinweis: Neuste Ausgabe: IEC 60749-5:2023 ED3

Vorschau

Bestehende oder zukünftige Amendments und Versionen müssen separat erworben werden.

Sprache
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Zusammenfassung

IEC 60749-5:2023 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 60749-5:2023 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. This test method is considered destructive. This edition includes the following significant technical changes with respect to the previous edition: a) The specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test; b) The specification of the test equipment fixtures is changed to require the avoidance of condensation on devices under test and on electrical fixtures connecting the devices to the test equipment; c) replacement of references to “virtual junction” with “die”.

Produktspezifikationen

  • Redline von IEC
  • Ausgabedatum:
  • Edition: 3
  • Dokumenttyp: IS
  • Seiten
  • Herausgeber: IEC
  • Lieferant: IEC
  • ICS: 31.080.01
  • Internationales Komitee: TC 47

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Produktlebenszyklus