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Standard

IEC 60749-5:2023 ED3

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Zusammenfassung

IEC 60749-5:2023 is available as IEC 60749-5:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-5:2023 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. This test method is considered destructive. This edition includes the following significant technical changes with respect to the previous edition: a) The specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test; b) The specification of the test equipment fixtures is changed to require the avoidance of condensation on devices under test and on electrical fixtures connecting the devices to the test equipment; c) replacement of references to “virtual junction” with “die”.

Produktspezifikationen

  • Standard von IEC
  • Ausgabedatum:
  • Edition: 3
  • Dokumenttyp: IS
  • Seiten
  • Herausgeber: IEC
  • Lieferant: IEC
  • ICS: 31.080.01
  • Internationales Komitee: TC 47

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