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Standard

IEC 60749-15:2010 ED2

Revidiert

Hinweis: Neuste Ausgabe: IEC 60749-15:2020 ED3

Vorschau

Bestehende oder zukünftige Amendments und Versionen müssen separat erworben werden.

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Zusammenfassung

IEC 60749-15:2010 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect from the previous edition include: - editorial change in the scope; - addition of lead-free solder chemical composition specification.

Produktspezifikationen

  • Standard von IEC
  • Ausgabedatum:
  • Rückzugsdatum:
  • Edition: 2
  • Dokumenttyp: IS
  • Seiten
  • Herausgeber: IEC
  • Lieferant: IEC
  • ICS: 31.080.01
  • Internationales Komitee: TC 47

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